High-frequency multi-layer printed circuit board is a high frequency in a particular substrate CCL, the reference method for ordinary rigid PCB manufacturing process out of the high-frequency devices.
In the printed circuit board high-speed signal transmission line conductors, the current can be divided two categories: one is high-frequency signal transmission electronics products, this type of product is
And radio waves about, which is based sine wave signal transmission products, such as radar, radio, television and communications (mobile phones, microwave communications,
Fiber-optic communications, etc.); the other is high-speed logic signal transmission class electronic products, this type of product is a digital signal transmission, also with a square wave
Wave transmission related to this product in the beginning mainly in computers, computers and other applications, now has rapidly developed and applied to electronic appliances and communication products on the Deep
Shenzhen City tome Electronics Co., Ltd. is a professional production of circuit boards has many years of experience in circuit board company, whose main products include: High frequency board, multi-
Laminates, aluminum plate, etc., in the production of high-frequency board has a very rich experience, the company since its inception has been seeking to become the industry's best manufacturers, to mention
For the highest quality printed circuit board's strategic objectives the company has successfully obtained the ISO/TS16949 quality system certification, ISO14000 environmental management system certification, UL
Certification system we are able to quickly model for customers to solve fairs and trial of new products quickly needs our company has developed and produced thousands of models of cooling metal
Substrates, users all over the country can be tailor-made for the client-sided, double-sided, four various conductive metal circuit boards (metal PWB) - copper substrates, aluminum plate alumin
um pcb, iron substrates. thickness 0.8mm-5.0mm, solid bottom of the cup shape with reflective crystal, crystalline solid surface, multi-layer multi-cup, plastic metal combination, pore insulation
Plug-plate type, double-sided circuit interconnect metallization hole type crystalline solid bottom of the cup, cup bottom wire multi-cup, single circuit type, radiator type, surface type circuit, bosses,
Type, contiguous, Right Angle bending type, organic resin metal combination such as thousands of shape line width, line spacing can be processed to 0.1mm (copper foil thickness less than 0.036mm).