Single-side and Double-sides process:
1、 May cut,drill,debur and bake at 150℃ maximum for 8 hours maximum.
2、 May etch in any etchant except chromic/sulfuric.
3、 May plate through holes.
4、 May wash and bake at 120℃ maximum for 30 minutes maximum or hot air blow dry.
5、 May apply dry film at 110℃ maximum for 30 minutes maximum.
6、 May print pattern and bake at 120℃ maximum for 60 minutes maximum.
7、 May plate nickly/gold and bake at 120℃ maximum for 60 minutes maximum.
8、 May Immersion Au and bake at 90℃ maximum for 10minutes maximum
9、 May OSP and bake at 90℃ maximum.
10、 Non-flame and HB rated boards may use any solder resist.v rated boards may be coated with the solder resists shown in the following table and baked at 130℃ maximum for 10 minutes maxmum.
11、 May hot air leveling at 260℃ maximum for 4 seconds maximum.
12、 May punch or route to required dimensions.
13、 May rinse and dry.
14、 No other plating operations performed and no other temperatures over 100℃(212℉) encountered.
