Technical Capabilities | |
Item | process capacity |
No. of layer | Double side to 20 Layers.Build up 2+N+2,Double Sided aluminium PCB , metal core PCB |
Materials | FR-4 ,CEM-1/3,HF material,Teflon,Rogers,Bergquist,high TG,PTFE,aluminum. |
Board thickness | 0.1mm to 4.0mm 0.4mm up for 4 layers 4.0mm for 16 layers |
Copper cladding | (inner)18um to 105um (Outer)12um to 210um |
Maximum size | 500*1500mm |
Minimun trace | (width/spacing)0.075mm |
Hole size tolerance | (NPTH)±0.075mm (PTH)±0.05mm |
Diameter tolerance | (NPTH)±2mil (PTH)±3mil |
Min.Distance hole/line to edge | 20mil 12mil |
Minimun welding ring thickiness | 0.1mm |
Minimun isolation pad | 10mil |
Minimun solder mask width | 0.075mm |
Minimum solder window | 0.05mm |
Impedance tolerance | ±10% |
Minimun hole size | Finish,mechanical -0.15mm |
Aspect ratio | Vias≤10:1 |
Surface finishs | HAL,Immersion gold,Flash gold, Pre-flux(OSP),Selective gold plates and gold tabs,Stripping blue glue,Carbon oil,Pure tin plating,silver plating,tin plating,thickness Finger plating. |
Quality Standards | Accept spcifications of customer and IPC(class II or III） |
