CCAF-04-A Aluminum-base copper-clad laminate The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate Thickness of the copper: 35um Thickness of the diclectric: 80um(matrial of the high heat dissipation) Thickness of the aluminum-base: 1.5mmCCAF-04-A Aluminum-base copper-clad laminate The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate Thickness of the copper: 35um Thickness of the diclectric: 80um(matrial of the high heat dissipation) Thickness of the aluminum-base: 1.5mm
CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5mm
Material | FR-4 / Hi-Tg FR-4 /CEM-3/CEM-1/Aluminium |
Layer | single layer,double layer,multi-layer(4-10) |
Board Thickness | 0.3mm-3.0mm,+/-0.1mm(tolerance) |
Copper Thickness | 1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5% |
Impedance Control | ±10% |
Bow and Twist MAX. | 0.75%(SMT) |
Anti-strip | 0.88N/mm |
Resistance | ≤20Ω |
Reactance | 500V |
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