Plate surface foaming is actually the problem of plate surface binding force, and then extended is the surface quality of plate surface. This includes two aspects: 1. Problem of plate surface cleanliness; 2. Micro-surface roughness (or surface energy) problem. Now in the process of production and processing, some specific PCB circuit board board surface foaming reasons are summarized as follows:
The activity of copper liquid is too strong;
The content of the three components in the newly opened tank or tank liquid of the copper sinking liquid is too high, especially the high copper content, which will cause too strong activity of the tank liquid, rough chemical copper deposition, and excessive hydrogen and copper oxide mixed in the chemical copper layer, resulting in the decline of the coating material quality and poor binding force. Take the following methods to solve: reduce the content of copper, including three components, appropriately increase the content of complexation agent and stabilizer, appropriately reduce the temperature of the tank liquid.
In the process of graphics transfer, insufficient water washing after development, too long placement time or too much dust in the workshop will cause poor cleanliness of the plate surface, and slightly poor fiber treatment effect, resulting in potential quality problems.
Copper plating before the acid immersion tank did not pay attention to the replacement in time, too much pollution in the tank liquid, or the copper content is too high, not only will cause the cleanliness of the plate surface, but also will cause the rough plate surface and other defects.
Organic pollution in electroplating tank, especially oil, is more likely for automatic line.
In winter, some factories do not pay attention to the live tank into the tank, especially the plating tank with air mixing, such as copper and nickel. For the nickel tank in winter, it is best to add a warm water washing tank before the nickel plating (the water temperature is about 30-40 degrees), to ensure that the initial deposition of the nickel layer density is good.
In the actual production process, there are many reasons for the plate surface foaming, for the foaming phenomenon caused by the different equipment and technical level of manufacturers, to the specific situation specific analysis, not generalized, mechanically copied.
The above for you to summarize the PCB circuit board surface bubble some specific reasons, just to provide you with a direction to solve the problem, I hope to help you.
