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High Quality Rigid-Flex PCB Board Specification PCB Design

  • Type: Flexible Circuit Board Material: Fiberglass Epoxy Mechanical Rigid: Fexible Base Material: Pi Model: PCB Surface Finish: HASL/ Enig/OSP Min. Line Space: 0.075mm/ 3mil Copper Thickness: 0.5oz - 10 Oz Sepecial Tech: BGA, Impedance Control, Blind Buried Hole Transport Package: Vacuum Packing...

  • Type: Flexible Circuit Board

  • Material: Fiberglass Epoxy

  • Mechanical Rigid: Fexible

  • Base Material: Pi

  • Model: PCB

  • Surface Finish: HASL/ Enig/OSP

  • Min. Line Space: 0.075mm/ 3mil

  • Copper Thickness: 0.5oz - 10 Oz

  • Sepecial Tech: BGA, Impedance Control, Blind Buried Hole

  • Transport Package: Vacuum Packing or Bubble Bag

  • Origin: China

  • Item 
    specification
    Printed circuit boards
    1-20 layer rigid PCB boards; HASL, Carbon oil, ENIG, Hard gold plated, BGA, COB, HDI, Impedance, etc.
    Min. board thickness
    0.15mm, 0.2mm super thin FR4 PCBs
    Featured crafts
    HASL, carbon oil, hard gold plated, BGA, COB, HDI, impedance, blind and buried vias, half holes, immersion tin plating, etc
    Fast PCB
    24/36H fast PCB prototype
    Flex-rigid pcb
    2-12 layer rigid flex pcb boards
    Other service
    PCB design, PCB +BOM clone, PCB assembly(SMT, DIP...)
NO
Item
Process capability
1
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
2
Max layer count
20 layers
3
Min base copper thickness
1/3 OZ (12um)
4
Max finished copper thickness
10 OZ (350um)
5
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
6
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
7
Min spacing between hole to inner layer conductor
6mil (0.15mm)
8
Min spacing between hole to outer layer conductor
6mil (0.15mm)
9
Min annular ring for via
4mil (0.1mm)
10
Min annular ring for component hole
4mil (0.1mm)
11
Min BGA diameter
4mil (0.1mm)
12
Min BGA pitch
4mil (0.1mm)
13
Min hole size
0.15mm(CNC); 0.1mm(Laser)
14
Max aspect ratios
8.01
15
Min soldermask bridge width
4mil (0.1mm)
17
Min thickness for insulating layer
1mil (0.025mm)
18
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
19
Surface treatment type
ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
plating
20
Max PCB size
Multi-layer: 600*550mm 1-2 layer: 500*1200MM


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