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Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3 Copper Thickness:0.3oz-6oz Board Thickness:0.2mm-6mm Min. Hole Size:0.1mm Min. Line Width:0.15mm Min. Line Spacing:0.15mm Surface Finishing:HASL,ENIG,OSP Layer No.:1-32 Layers PCB Test:Flying probe and AOI
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