Model NO.: ENIG pcb Production Process: Additive Process Base Material: PP,Copper Insulation Materials: Epoxy Resin Brand: Kb,Shengyi,Rogers ,Iteq etc Shenzhen: China Trademark: Abis Transport Package: Vacuum Packing Specification: 265*124 mm Origin: China HS Code: 85340010
Shenzhen: China
Rigid RPCB Manufacturing Capability
Rigid RPCB Manufacturing Capability
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Item | RPCB | HDI |
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) |
minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) |
minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) |
maximum aspect Ratio (thickness/hole diameter) | 10：1 | 8:1 |
impedance control accuracy | +/-8% | +/-8% |
finished thickness | 0.3-3.2MM | 0.2-3.2MM |
maximum board size | 630MM*620MM | 620MM*544MM |
maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) |
minimum board thickness | 6MIL(0.15MM) | 3MIL（0.076MM） |
maximum layer | 14层 | 12层 |
Surface treatment | HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag | Immersion Gold、OSP、selectiveimmersion gold、 carbon print |
Min/max laser hole size | / | 3MIL / 9.8MIL |
laser hole size tolerance | / | 10% |
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