Processing Technology:Electrolytic Foil Base Material:Copper Insulation Materials:Organic Resin Brand:FD Certification:UL, RoHS, ISO9001: 2000,TS16949 Trademark:FD Transport Package:by Vacuum Packing in Cartons Specification:UL, ISO9001, ROHS Origin:ShenZhen China
PRODUCTION CAPACITY
| Items | Parameter | Special | ||
| Layers Counts | 2-20 | |||
| Board material | FR-4,Aluminum | High Tg FR4 | ||
| max Fabrication area | 580×700mm | 500mm×3000mm | ||
| Board thickness | 0.1-3.2mm | |||
| Camber | Double Side multi -layers | d ≤0.075mm d ≤1% | d≤0.05mm | |
| Impedance | ±7% | ±5% | ||
| PTH tolerance | d>5.0 | ±0.076mm | ||
| 0.3<<>d≤5.0 | ±0.05mm | |||
| d≤0.3 | ±0.08mm | |||
| Min finished hole size | 0.15mm | |||
| Hole copper thickness | ≥20um | |||
| Min track width, spacing | 0.05mm ×0.05mm | |||
| Profile size | ±0.1mm | ±0.05mm | ||
| Profile | Routing,Punch,Cut,V-cut,Chanfer | |||
| Surface finish | Immersion Gold:0.025~0.075um | |||
| Gold finger:≥0.13 um | ≥1.0 um | |||
| OSP:0.2-0.5µm | ||||
| HAL:5~20 um | ||||
| LEADFREE HAL:5~20 um | ||||
| Surface plating | Solder mask: Black Green White Red Thickness≥17 um,Block,BGA | |||
| Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | ||||
| Ppeelable mask: red bule thickness≥300 um | ||||
| Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm | ||||
QUALITY OFFERING
PRODUCTION MAIN EQUIPMENTS
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