Basic Info Model NO.: FLCA-021 Processing Technology: Electrolytic Foil Base Material: Fr4 Insulation Materials: Epoxy Resin Brand: LX Board Material: Fr4, Rogers Board Layer: 1-26 Board Thickness: 0.8mm-3.0mm Copper Thickness: 0.5 Oz-6 Oz Max PCB Size: 650*650mm Min Hole: 0.15mm Min Trace: 0.15mm Surface Finishing: Enig Solder Mask: Any Lead Time: 4-5 Working Days Trademark: FL Transport Package: Vacuum+Carton Packing Specification: RoHS, ISO9001, UL, SGS Origin: Shenzhen, China HS Code: 8534009000 For some designs, dielectric PCB properties are critical Whether it's high-speed designs, RF, microwave, or mobile applications - where power management is key, you're finding more situations that require dielectric PCB properties in your prototypes that standard FR-4 just can't deliver. We know that. That's why we've added Rogers dielectric materials to our production line. These new low-loss dielectric materials mean greater performance for your high-demand PCB prototypes.
| Material | Layer | Thickness (mm) | Surface finish | Soldermask | Legend | Copper | Panel Size(mm) | |||
| Inner | Outer | L | W | up | ||||||
| FR4 | 4 | 1.60 | ENIG | Green | White | / | 1OZ | 290.20 | 138.60 | 3 |
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