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FR4 Hard Plating Holes Cob Pcb Quick Turn Pwb Cem Pcb Ul Approved

  • SHENZHEN FOUND PRINTED CIRCUIT BOARD CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2014,the core business are Multilayer(including HDI) middle up to high volume PCB orders ,High Frenquency and Metal Core PCB orders . For offering all customers better service , we can offer flexible PCB and rigid-flexible PCB . Through the hard work and dedication of all employees during the past years, we are already one excellent PCB manufacturer in China. Our company covers over 15000 square meters modernized workshop area and a complete set of advanced production equipment ,with about 500 fixed employees and more than 100 of senior management ,craftsmen and engineers., a group of quality talents with over ten years of experience in PCB industry. We warmly welcome your visit and cooperation.

  • Model NO.: FD-569745

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Processing Technology: Enig

  • Base Material: Copper

  • Brand: FD

  • Surface Finihsing: Immersion Gold

  • Trademark: Ucreate PCB

  • Specification: IP class -2

  • HS Code: 8534009000

  • Structure: Multilayer Rigid PCB

  • Material: Polyester Glass Fiber Mat Laminate

  • Flame Retardant Properties: V0

  • Production Process: Subtractive Process

  • Insulation Materials: Organic Resin

  • Board Layer: 10L

  • Lead Time: 6-8 Working Days

  • Transport Package: Vacuum Packing

  • Origin: Shenzhen

Product Describe:

FilesGerber, Protel, Powerpcb, Autocad, Cam350, etc
MaterialFR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.1 - 30 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirementsBuried and blind vias, Impedance control, via plug, BGA soldering and gold finger



Producr Process
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM,  we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information

Packager&Shipping method
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

                          

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