Irregular Hybrid Cars PCBA
PCB Technical standard:
| Shenzhen Found printed circuit Board Co.,LTD | ||
| Seq | Item | capability |
| 1 | Base Material | FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc |
| 2 | Layers | 1-40 ( ≥30 layers needs review ) |
| 3 | Finished inner/outer copper thickness | 0.5-6OZ |
| 4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
| Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% | ||
| 5 | Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
| 6 | Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
| 7 | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
| Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil | ||
| 8 | Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
| 9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
| 10 | Aspect Ratio | 15:01 |
| 11 | Min welding ring | 4mil |
| 12 | Min solder mask bridge | ≥0.08mm |
| 13 | Plugging vias capability | 0.2-0.8mm |
| 14 | Hole tolerance | PTH: +/-3mil NPTH: +/-2mil |
| 15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| 16 | Solder mask color | Green,yellow,black,blue,red,white,matte green |
| 17 | Component mark color | white,yellow,black |
| 18 | Surface treatment | OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U'' ENEPIG: PB 2-5U''/ Au 1-8U'' Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U'' |
| 19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
| Min spacing from test pad to board edge : 0.5 mm | ||
| Min conductive resistance : 5 Ω | ||
| Max insulation resistance : 250 MΩ | ||
| Max test voltage : 500 V | ||
| Min test pad diameter : 6 mil | ||
| Min test pad to pad spacing : 10 mil | ||
| Max test current : 200 MA | ||
| 20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
| Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch | ||
PCB Manufacturing Capacity:
Base material:FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc
PCBs: Rigid(0-22layers),Flexible(1-8layers),Rigid-flex(1-16layers,flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness: 0.2mm--10mm
Copper thickness: 0.25 Oz -8 Oz
Max Panel Size: 1500 mm × 560 mm
Min. Hole Size: 0.075mm(3mil)
Min. Line Width/Spacing: 3mil
Surface Finishing: HASL/HAL, HASL Lead Free,ENIG,immersion silver,immersion tin,OSP,Plating Hard Gold,etc.
Solder Mask Color: White, Black, Yellow, Green, Red, etc.
Silkscreen Color: Black, White, Yellow, Red, Blue, etc.
Special Process: Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
Full Range Of Testing Services:
▪AOI
▪Function testing
▪In circuit testing
▪X-ray for BGA testing
▪3D paste thickness test
▪Flash testing and earth bonding tests can also be undertaken where required
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
Welcome to our cooperation!
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