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Item                  Capabilities
Number of Layers:2-20 layers 
Finished Board Size(Max):21.5″×24.5″(546mm×622mm)
Finished Board Thicknes:0.126″- 0.016″ (0.3mm-3.2mm)
Finished Board Thickness:±10% 
Tolerance:±3mil (board thickness≤ 0.8mm)        
Warp age(Min):≤0.7%
Drill Hole Diameter:0.005"-0.255" (0.15mm~6.5mm)
Base Copper Thickness of Outer Layer:1/3 OZ-3OZ (0.012mm -0.102mm)
Base Copper Thickness of Inner Layer:1/2 OZ-3 OZ (0.017mm -0.105mm)
Type of Base Material:FR-4 (130ºCTg-180ºCTg),CEM3,etc
Aspect Ratio of Plated Hole(Max):10:01:00
Hole Diameter Tolerance(PTH):±3mil ( ±0.075mm)
Hole Diameter Tolerance(NPTH):±1mil ( ±0.025mm)
Copper Thickness of PTH Wall:≥0.8mil (≥0.020mm)
Design Line Width/Space:H/HOZ 3.0mil/3.0mil(0.075mm /0.075mm)
of Inner Layer(Min):1/1OZ 4mil/4mil(0.1016mm/ 0.1016mm)
                               2/2OZ 5mil/5mil(0.127mm/0.127mm)
Design Line Width/Space:T/TOZ 3.0mil/3.0mil (0.075mm/ 0.075mm)
of Outer Layer(Min):H/HOZ 3.5mil/3.5mil(0.089mm/0.089mm)
                               1/1OZ 4.5mil/4.5mil (0.114mm/0.114mm )
                               2/2OZ 6mil/6mil (0.152mm/0.152mm )
                               3/3OZ 7mil/7mil (0.152mm/0.152mm)
Solder Mask Bridge(Min):2. 5mil (0.064mm)
Dimension Tolerance (Hole to Edge)(Min):±4mil ( ±0.101mm)
Thermal Shock:288 ºC 10secs(3times) 
Ionic Contamination:<1.56ug/cm2(NaCl)
Peel Strength:≥1.4N/mm
Natural Impedance Control:±10%
Solder Mask Strength:>6H
Surface Treatmet:Nickel /Gold Plating, HASL(Lead-free), OSP
                             ENIG, Immersion Silver, Carbon Oil, 
                             Peelable Mask, etc.
 

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