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Single Layer LED Board Pcba

• Basic Info Model NO.: LP-11 Condition: New Copper Thickness: 1-6oz Thermal Conductivity: 0.8-3W/M.K Board Thickness: 0.3-5mm Color Temparature: 2600-9000K CRI: >=80 Brightness Grade: >60 Lm LED Type: 3528/2835/5050/3014/5730/3030 Trademark: Abis Circuits Transport Package: Vacuum Packing Specification: Custom Origin: Shenzhen, China HS Code: 85340010 Description Capability PCB Surface Finishes electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver PCB Board Max. Size 1200mm×600mm PCB Board Min. Size 5mm×5 mm Bow & Twist Tolerance Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% Min. Board Thickness & Tolerance 0.2mm±0.08mm Min. trace/spacing Tin board:0.2mm±20%(8mil±0%) gold board:0.075mm±20%(3mil±0%) Copper to Board Edge Spacing 0.5mm(20mil) Hole to Trace Spacing 0.3mm(12mil) Min. Hole Diameter 0.2mm±.076mm(8mil±3mil) Min. Hole Clearance 0.4mm±.076mm(16mil±3mil) Copper Thickness on Hole Wall 20-25um(0.79mil-1.0mil) Hole Location Tolerance ±0.076mm(l±3mil) Min Diameter of Punching Hole FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) Min. Punching Slot FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) Trace width variation ±0.076mm(±3mil) Outline Tolerance Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) V-CUT Registration Tolerance±0.2mm (±8mil) Type Single-sided, double-sided, multi-layer Major Material FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base Thickness 0.2-3.5mm Base Copper Thickness 11um 35um 70um 105um Max. aspect ratio(board thickness: hole size) 8:1 V-Cut Angle Tolerance ±5° V-Cut Board Thickness 0.4mm -3.2mm(16mil -128mil) Min SMT Pitch 0.3mm(12mil) Min. Component mark 0.15mm(6mil) Min. width of annular ring(finished) 0.15mm(6mil)/side Min pad opening 0.076mm(3mil) Min S/M Bridge ±0.076mm(±3mil) carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times