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Medical Device Used Rigid-Flex PCB

  • Standard Flex Materials: Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) Adhesiveless Copper Clad Base Material 1 mil to 5 mils Flame Retardant Laminate, Base Material, and Coverlay High Performance Epoxy Laminate and Prepreg High Performance Polyimide Laminate and Prepreg UL and RoHS...

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) 
Adhesiveless Copper Clad Base Material 1 mil to 5 mils 
Flame Retardant Laminate, Base Material, and Coverlay 
High Performance Epoxy Laminate and Prepreg 
High Performance Polyimide Laminate and Prepreg 
UL and RoHS Compliant Material on request 
High Tg FR4 (170+ Tg), Polyimide (260+ Tg) 
Base Copper: 
1/3 oz. - .00047 in. (.012mm)--rarely used 
1/2 oz. - .0007 in. (.018mm) 
1 oz. - .0014 in. (.036mm) 
2 oz. - .0028 in. (.071mm) 
Solder Mask: 
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm) 
with 0.5 to 2 mil Adhesive (.012mm - .051mm) 
LPI and LDI Flexible Soldermasks

ItemManufacture Capability
Layers1-26 Layers
Material TypesFr-4, Fr-5, High-Tg, Halogen Free, Rogers, Isola, Taconic, Arlon Teflon,                                                                                           Aluminum Based
Max. Panel Dimension39000mil * 47000mil  / 1000mm * 1200mm
Outline Tolerance± 4mil ± 0.10mm
Board Thickness8mil-236mil
Board Thickness Tolerancemil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance± 10%
Dielectric Thickness3mil-8mil / 0.075mm-0.20mm
Min. Track Width3mil / 0.075mm
Min. Track Space3mil / 0.075mm
External Cu ThicknessHOZ-6OZ / 17um~210um
Internal Cu ThicknessHOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC )6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension4mil-236mil / 0.1mm_6.0mm
Hole Tolerance± 2mil / ± 0.05mm
Hole Position Tolerance± 2mil / ± 0.05mm
Laser Drilling Hole Size4mil / 0.1mm
Aspect Ration12: 1
Solder MaskGreen, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge2mil / 0.050mm
Plugged Hole Diameter8mil-20mil/ 0.20mm-0.50mm
Impedance Control V-scoring± 10%
Surface FinishingHASL, HASL(lead Free), Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold( up to 100u" )



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